| General information |
| |
| Type | CPU / Microprocessor |
| Market segment | Server |
| Family | Intel Xeon (咨询特价) |
| Model number @ | X(咨询特价) |
| CPU part numbers | - AT80614005913AB is an OEM/tray microprocessor
- BX80614X(咨询特价) is a boxed microprocessor
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| Frequency @ | (咨询特价) MHz |
| Turbo frequency | 3733 MHz (1 or 2 cores) 3600 MHz (3 or more cores) |
| Bus speed @ | 6.4 GT/s QPI (3200 MHz) |
| Clock multiplier @ | 26 |
| Package | 1366-land Flip-Chip Land Grid Array (FC-LGA10) |
| Socket | Socket 1366 / B / LGA(咨询特价) |
| Size | 1.77" x 1.67" / 4.5cm x 4.25cm |
| Introduction date | Feb 13, (咨询特价) |
| Price at introduction | $1663 |
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| S-spec numbers |
| |
| | ES/QS processors | Production processors | | Part number | Q4F1 | SLBVX | | AT80614005913AB | + | + | | BX80614X5690 | | + | |
| |
| Architecture / Microarchitecture |
| |
| Microarchitecture | Nehalem |
| Platform | Tylersburg-EP Tylersburg-EN Tylersburg-WS |
| Processor core @ | Westmere-EP |
| Core stepping @ | B1 (Q4F1, SLBVX) |
| CPUID | 206C2 (SLBVX) |
| Manufacturing process | 0.032 micron High-K metal gate process |
| Data width | 64 bit |
| The number of cores | 6 |
| The number of threads | 12 |
| Floating Point Unit | Integrated |
| Level 1 cache size @ | 6 x 32 KB instruction caches 6 x 32 KB data caches |
| Level 2 cache size @ | 6 x 256 KB |
| Level 3 cache size | 12 MB |
| Physical memory | 288 GB |
| Multiprocessing | Up to 2 processors |
| Features | - MMX instructions
- SSE / Streaming SIMD Extensions
- SSE2 / Streaming SIMD Extensions 2
- SSE3 / Streaming SIMD Extensions 3
- SSSE3 / Supplemental Streaming SIMD Extensions 3
- SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 @
- AES / Advanced Encryption Standard instructions
- EM64T / Extended Memory 64 technology / Intel 64 @
- NX / XD / Execute disable bit @
- HT / Hyper-Threading technology @
- VT-x / Virtualization technology @
- VT-d / Virtualization for directed I/O
- TBT / Turbo Boost technology @
- TXT / Trusted Execution technology
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| Low power features | Enhanced SpeedStep technology @ |
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| Integrated peripherals / components |
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| Integrated graphics | None |
| Memory controller | - The number of controllers: 1
Memory channels: 3 Supported memory: DDR3-800, DDR3-1066, DDR3-(咨询特价) Maximum memory bandwidth (GB/s): 32 ECC supported: Yes |
| Other peripherals | Quick Path Interconnect (2 links) |
| |
| Electrical / Thermal parameters |
| |
| V core @ | 0.75V - 1.35V |
| Maximum operating temperature @ | 78.5°C |
| Thermal Design Power @ | 130 Watt |